Semiconductor Reliability Testing

Throughout the semiconductor industry, engineers design integrated circuits and IC devices. This process of manufacturing semiconductors can consist of more than a hundred steps. Our Thermal Testing Solutions and temperature test chambers are an integral part of the final test process.

MPI Thermal TA-5000 series state-of-the-art thermal stressing solutions are changing the way thermal cycling tests of DUT’s are performed allowing semiconductor manufacturers to improve performance, reliability, and profitability through greater efficacy of manufacturing Semiconductor ICs processes.

Semiconductor Testing | Semiconductor Reliability Testing | Semiconductor Test Equipment | Thermal Testing | Thermal Characterization | Thermal Testing Solutions | Highly Accelerated Stress Test

Semiconductor Thermal Testing Applications


MPI ThermalAir Test Systems Brings Precise Thermal Testing capabilities directly to the parts, components, PCBs, MEMs, MCMs, assemblies, and electronics. Our flexible, mobile thermal air forcing systems and temperature test chambers provide a stream of hot or cold air directly to the test. ThermalAir provides engineers and researchers an accurate temperature controlled test environment capable of performing rapid temperature cycling in their lab or on the production floor.

Products Overview


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Thermal Characterization
of Semiconductor IC Packages

Thermal characterization of packaged semiconductor devices is critical for the performance and reliability of IC applications. Thermal cycling, thermal stressing, and temperature characterization must be taken into account to ensure product reliability.

TA-5000 Series thermal testing solutions are a series of high capacity thermal air stream systems that are used for temperature testing, fast thermal cycling and device temperature characterization of components, hybrids, modules, PCBs, and other electronic and non-electronic assemblies at precise temperatures from -100°C to +225°C

Thermal Cycling Test | Semiconductor Testing | Rapid Temperature Cycling | Accelerated Life Testing | Semiconductor Test Equipment | Heat Stressing

Highly Accelerated Stress Tests are performed to to evaluate and predict Fatigue Life of Semiconductor Devices. These thermal stress tests are repeated, cycling from high temperature testing ranges to a low temperature testing ranges to accurately predict the fatigue life cycle of a device through heat stressing and failure analysis. 

ThermalAir thermal cycling test systems perform at the the mil-spec thermal testing range of -55°C to +125°C, with fast thermal cycling test capabilities in just seconds. Control temperature transition times, set ramp, soak, and cycle with a touch.

This is why the MPI Thermal TA-5000 Series ThermalAir Thermal Cycle Test Systems are used for accurate temperature testing and are an integral part of the semiconductor testing, manufacturing, and IC packaging process.

Semiconductor Test Equipment

Products Overview


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Some Applications


  • Thermal Cycling Test
  • Semiconductor Reliability Testing
  • Fatigue Life Prediction
  • Heat Stress Analysis
  • Accelerated Stress Testing
  • PCB Thermal Analysis
  • Accelerated Life testing
  • Thermal Characterization
  • Heat Stress Analysis

          And More…



Our Precision Thermal Stress Test Solutions use a direct temperature-controlled stream of hot or cold air to provide a precise environment for highly accelerated testing, thermal conditioning and rapid thermal cycling tests of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature test solutions enables an accurate thermal cycling test, providing a platform to perform precise temperature simulation tests in situ, at a specific location, at your tester station, test bench, or directly on the unit under test. Our portable self-contained thermal testing solutions only need to be plugged in and you’re ready for test of electronic semiconductor IC devices.


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Semiconductor Testing

Product and Test Engineers in the lab and on the semiconductor production floor use and share the ThermalAir thermal stress testing solutions to bring their devices to temperature ranges from -55°C to +125°C in just seconds. ThermalAir environmental temperature testing solutions provide accelerated thermal cycling through a hot and cold air stream directly on the device under test (DUT). The ThermalAir TA-5000 has a thermal testing range from -100°C to +225°C without the use of Ln2 or CO2.

  • Ultra Cold Temperatures maintained at 50&60Hz
  • Dual Touch Screens Front Panel & Thermal Head
  • Plug-in anywhere from 200~250VAC, 1Ø
  • ECO Smart DC system for up to 50% energy saving
  • No voltage configuration to use at different locations
ThermalAir Series of thermal testing solutions and temperature test chambers play a critical role in determining product reliability by providing flexible thermal stress testing systems that utilize a temperature controlled hot and cold air stream directly to the parts and electronics requiring thermal stress testing.


  • Temperature Test Range -100°C to +225°C
  • No LN2 or Co2
  • Fastest ramp rates
  • Up to 20 SCFM Air Flow
  • Set Ramp, Soak & Cycle
  • Real Time Graphic Display
  • Data Logging
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Semiconductor Testing | Temperature Testing Semiconductor | Thermal Stress Testing | Semiconductor Test Equipment Manufacturer | Accelerated Stress Testing

 Semiconductor Test Equipment


Semiconductor Reliability Testing


Temperature Testing Systems