Telecommunications Industry
Telecommunications systems, and equipment must be designed to meet a variety of stringent specifications, most importantly the Telcordia test requirements. Common systems and components requiring testing include fiber optics, line protector units, switch boxes, sensors, modules, connectors, outdoor networks interface devices, network switching systems, switching racks, cell phones, and more.
Environmental temperature controlled chambers can just go so far when it comes to precise thermal control, fast ramp rates, and narrow temperature margins in some product thermal test procedures and processes. Instead of taking your parts to a large temperature controlled chamber, ThermalAir Systems bring the temperature to your components at your test location.
Temperature Testing from
Reliability Testing | 100G Optical Transceiver – Accelerated Life Testing – Test Chambers – Temperature Conditioning – Temperature Cycling Optical Transceivers | HALT Testing
ThermalAir Temperature Conditioning Systems
The ThermalAir systems allow testing with temperature accuracy of +/- 1.0°C throughout the full temperature range -100°C to +225°C and temperature cycling while having full control of the temperature ramp rate. Our systems can ramp in seconds not minutes. This new thermal test technology gives you the ability to control the ramp rate with temperature set point functions.The ThermalAir systems provide localized temperature directly at your test site. This enables you to bring the temperature to the test station in engineering and manufacturing test.
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Thermal Cycling and Temperature Conditioning
Telecommunication components and hardware need to meet Telcordia (Bellcore) specifications that require environmental humidity, vibration, and temperature testing. Thermal cycling, temperature conditioning, and environmental stressing of devices is considered vital to reliability and durability by simulating test conditions to meet user’s operating requirements in the field of use.
MPI Thermal TA-5000 series state-of-the-art thermal testing solutions are changing the way thermal cycling tests of DUT’s are performed allowing telecommunications equipment and component manufacturers to improve performance, reliability, and profitability through greater efficacy of manufacturing thermal testing processes.
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Reliability Testing | CFP2 – Accelerated Stress Testing – Temperature Test 5G – Thermal Cycle Test Optical Transceivers – Thermal Testing Optical Transceivers | HALT Testing
ThermalAir TA-5000A Rapid Thermal Inducing System
Whether it’s thermal profiling, temperature cycling, thermal shock, or temperature conditioning, ThermalAir Temperature Test Systems can help with your temperature requirements.
ThermalAir Temperature Test Systems are used for fiber optic manufacturing final test applications in engineering development and production at temperature ranges from -40°C to +90°C to thermal test and temperature calibrate these devices at precise temperatures. ThermalAir TA-5000 rapid thermal cycling system provide a controlled temperature of hot and cold air directly on the fiber optic component and optical modules under test with temperatures ranging from -100°C to +225°C with an accuracy of +/- 1.0C for fiber optic components and optical SFP transceivers.
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In the Telecommunications Industry, electronic components and equipment must be tested to confirm that everything functions properly as a system. In the telecommunications manufacturing process, individual components, modules, and other components need be temperature tested to assure reliability. Each piece needs to be designed to work when exposed to harsh temperature environments.
With Global warming on the rise, telecommunications equipment, components, and materials need the ability to withstand sudden changes in temperature. ThermaAir temperature test systems help provide and ensure long-term reliability testing of optical fiber components under harsh environmental stress conditions by testing components against the effects of thermal shock.
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100G Optical Transceiver – Thermal Profiling Telecom Components – Temperature Test Chamber – Thermal Shock – Thermal Testing Optical Transceivers | HASS Testing
HALT & HASS Testing
In the Telecommunications Industry, a trend towards miniaturization and increased power density can be observed in both datacom equipment and throughout the electronics industry. These evolution’s bring with them many thermal management challenges.
HALT / HASS testing is the fastest and economical way to improve product reliability. HALT (Highly Accelerated Life Test) is used to discover design flaws by exposing parts & components to thermal stress testing and thermal cycle testing. Highly Accelerated Stress Screening (HASS) use temperature stress tests to eliminate design flaws, develop a reliable products, and filter out early product failure issues. HALT/HASS testing helps determines a product operating and failure limits by applying temperature stress to products through simulated thermal testing and continuous failure analysis.
ThermalAir Thermal Test Systems for Fiber Optic Component Manufacturers
The design challenges go well beyond simply delivering processing power and high-speed data transfer. Design engineers must also safely manage heat generated by those processes in the confines of tight vehicle packaging requirements, as well as ambient and cold temperature fluctuations, while adhering to stringent safety and reliability standards of the automotive industry.
ThermalAir Systems for Automotive Temperature Test Applications
- One system fits all temperature ranges -80°C to +225°C
- Plug in anywhere 200 to 25OVAC, 20amp, 50/60Hz
- Up to 24 SCFM continuous airflow capacity Hot & Cold
- Fastest temperature ramp rates without the use of LN2 or CO2
- Systems are easily moved for sharing between workstations or testers.
Environmental Stress Testing
Environmental stress conditions such as radiation exposure, temperature extremes, vibration, and dirt encountered by the military, on factory floors, and under the hoods of automobiles, these semiconductor devices need to keep working. To assure quality and reliability of electronic devices, semiconductor manufacturers need to simulate harsh environments during the engineering and production test stage. This is why the MPI Thermal TA-5000 Series ThermalAir temperature test products are part of the test.
Accelerated Life Testing – Temperature Conditioning – Temperature Conditioning – Reliability Testing – Thermal Profiling – Accelerated Stress Testing
ThermalAir Systems for Fiber Optic Components, Parts, and Accessories
The Telecommunications Industry promises fast and unlimited mobile internet access with the next generation of 5G technologies. This 5G technology is designed to provide faster downloads, streaming movies, wireless virtual reality, in addition to being the platform for the Internet of Things. 5G will mainly be used for more immersive entertainment and surveillance with much greater public exposure, especially in “Smart Cities”. Military uses have also been discussed. This 5th generation (5G) systems use high frequency with Gigahertz (GHz) wavelengths in the millimeter range.
Temperature Forcing System
MPI ThermalAir temperature forcing systems provide a direct thermal stream of clean dry hot and cold air directly to the part that needs to be thermal tested. In the lab or on the production floor, ThermalAir Series provide unparalleled thermal stress testing capabilities for scientist and engineers.
The ThermalAir system allows you to generate very precise controlled temperature for simulation test in Thermal Shock, Temperature Conditioning, Stress Screening, Temperature Cycling and more. Thermal test processes can be accomplished with our ThermalAir system. Ramp, Cycle, Dwell and Soak times are fully programmable with a touch of a button.
Temperature Cycling Test Systems
Product engineers and test engineers in the lab and on the semiconductor production floor use and share the ThermalAir temperature forcing systems to bring their devices to temperature ranges from -55°C to +125°C. ThermalAir environmental temperature test systems generate a hot and cold air stream directly on the device under test (DUT).
ThermalAir TA-5000B with Environmental Test Chamber
Precision Temperature Forcing Systems use a direct temperature-controlled stream of hot or cold air to provide a precise thermal environment for temperature testing, conditioning and cycling of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature system enables the test. This allows you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench or directly on the unit under test.
