Fiber Optics Industry
Thermal Testing of Fiber Optic Transceivers & Components
Fiber Optic manufacturers test their components to assure these integrated circuit parts will work at temperatures from -40°C to +90°C and beyond. To meet their customer requirements, there are temperature specifications for 40G/100G fiber optic transceivers and CFP2 / CFP4 / QSFP28 Modules. The purpose is to guarantee high speed communication networks work once put into operation within certain temperature environments.
Temperature Testing from
HALT/HASS Testing | CFP2 – Thermal Profiling Telecom Components – Temperature Test Chamber – CFP2 – Testing 40G Optical Transceivers | Reliability Testing
ThermalAir TA-5000A
Rapid Thermal Cycling System
ThermalAir Temperature Test Systems are used for fiber optic manufacturing final test applications in engineering development and production at temperature ranges from -40°C to +90°C to thermal test and temperature calibrate these devices at precise temperatures. ThermalAir TA-5000 rapid thermal cycling system provide a controlled temperature of hot and cold air directly on the fiber optic component and optical modules under test with temperatures ranging from -100°C to +225°C with an accuracy of +/- 1.0C for fiber optic components and optical SFP transceivers.
Download the Datasheets
Thermal Testing Fiber Optic Components
Commercial SFPs and other Fiber Optic components are designed to withstand temperatures between 0°C and 70°C. Some of RAD’s SFPs are industry hardened versions, designed and tested to operate from -40°C to +90°C at a temperature margin within the set point better than +/- 1.0°C. These and other families of Fiber Optic Transceivers specified temperature ranges may vary according to where the product in which the Fiber Optic Component SFP and others are used.
Industrially Hardened
DDM Calibration
External DDM Calibration
And More Advance specification requirements
Temperature Conditioning | Thermal Cycle Test Optical Transceivers – Thermal Profiling Telecom Components – Temperature Testing Optical Transcievers – Thermal Cycle Test Optical Transceivers – Telcordia Testing Standards | HASS Testing
Standard environmental test chambers cannot meet the narrow temperature accuracy margins.
ThermalAir systems produce a hot and cold stream of air directed on the device under test with very precise thermal control, providing a temperature range from -100°C to +225°C with an accuracy of +/- 1.0°C for fiber optic components.
The image to the right shows the ThermalAir
TA-5000 in different temperature test setups.
Download the Datasheets
Temperature Cycling Fiber Optic Components
There are many internal and external variables that affect thermal performance of pluggable I/O products. Qualification testing for the fiber bundle array assemblies included cable preconditioning testing, repeatability testing of the connector interface, vibration testing, thermal cycling.
MPI ThermalAir temperature forcing systems provide a direct thermal stream of clean dry hot and cold air directly to the part that require thermal cyling tested. Environmental stress screening, temperature conditioning, thermal shock and other temperature test requirements is what the ThermalAir temperature test systems bring to the test.
Failure Analysis
Thermal Shock
Rapid Thermal Cycling
Thermal Stress Analysis
Accelerated Stress Testing | Thermal Cycling Test – Reliability Testing – Temperature Testing Optical Transcievers – CFP2 – 100G Optical Transceiver | Reliability Testing
Fiber Optic manufacturers test their components to assure these integrated circuit parts will work at temperatures from -40°C to +90°C and beyond. To meet their customer requirements, there are temperature specifications for fiber optic transceivers. The purpose is to guarantee high speed communication networks work once put into operation within certain temperature environments.
MPI Thermal rapid thermal cycling equipment is portable and easily moved from one test to another. Component manufacturing companies use our fully self-contained ThermalAir systems to quickly bring their parts to temperature at the test area directly on the unit under test (UUT).
Rapid thermal cycling, failure analysis, and other reliability testing is why MPI Thermal systems are part of the manufacturing temperature test process.
Products Overview
ThermalAir Thermal Test Systems for Fiber Optic Component Manufacturers
The design challenges go well beyond simply delivering processing power and high-speed data transfer. Design engineers must also safely manage heat generated by those processes in the confines of tight vehicle packaging requirements, as well as ambient and cold temperature fluctuations, while adhering to stringent safety and reliability standards of the automotive industry.
ThermalAir Systems for Automotive Temperature Test Applications
- One system fits all temperature ranges -80°C to +225°C
- Plug in anywhere 200 to 25OVAC, 20amp, 50/60Hz
- Up to 24 SCFM continuous airflow capacity Hot & Cold
- Fastest temperature ramp rates without the use of LN2 or CO2
- Systems are easily moved for sharing between workstations or testers.
Temperature Inducing Equipment
Environmental stress conditions such as radiation exposure, temperature extremes, vibration, and dirt encountered by the military, on factory floors, and under the hoods of automobiles, these semiconductor devices need to keep working. To assure quality and reliability of electronic devices, semiconductor manufacturers need to simulate harsh environments during the engineering and production test stage. This is why the MPI Thermal TA-5000 Series ThermalAir temperature test products are part of the test.
Reliability Testing | Thermal Cycling Test – Accelerated Life Testing – Temperature Testing Telcordia – 40G – 100G Optical Transceiver | Reliability Testing
ThermalAir Systems for Automotive Electronics, Parts, and Accessories
The design challenges go well beyond simply delivering processing power and high-speed data transfer. Design engineers must also safely manage heat generated by those processes in the confines of tight vehicle packaging requirements, as well as ambient and cold temperature fluctuations, while adhering to stringent safety and reliability standards of the automotive industry.
Temperature Forcing System
MPI ThermalAir temperature forcing systems provide a direct thermal stream of clean dry hot and cold air directly to the part that needs to be thermal tested. In the lab or on the production floor, ThermalAir Series provide unparalleled thermal stress testing capabilities for scientist and engineers.
The ThermalAir system allows you to generate very precise controlled temperature for simulation test in Thermal Shock, Temperature Conditioning, Stress Screening, Temperature Cycling and more. Thermal test processes can be accomplished with our ThermalAir system. Ramp, Cycle, Dwell and Soak times are fully programmable with a touch of a button.
Thermal Profiling | 40G – Accelerated Stress Testing – Temperature Testing Optical Transcievers – 40G – Telcordia Testing Standards | Highly Accelerated Life Testing
Temperature Cycling Test Equipment
The design challenges go well beyond simply delivering processing power and high-speed data transfer. Design engineers must also safely manage heat generated by those processes in the confines of tight vehicle packaging requirements, as well as ambient and cold temperature fluctuations, while adhering to stringent safety and reliability standards of the electronics industry.
Environmental Stress Testing
Environmental stress conditions such as radiation exposure, temperature extremes, vibration, and dirt encountered by the military, on factory floors, and under the hoods of automobiles, these semiconductor devices need to keep working. To assure quality and reliability of electronic devices, semiconductor manufacturers need to simulate harsh environments during the engineering and production test stage. This is why the MPI Thermal TA-5000 Series ThermalAir temperature test products are part of the test.
