PCB Reliability Test

Printed Circuit Boards (PCBs) need to go through a series of extensive tests and inspections at each step of the manufacturing process to assure the products meets or exceed specifications.

 Reliability decreases exponentially in electronic components due to heat problems. ThermalAir series of thermal testing cycling test systems helps manufacturers design ICs, chips, and PCBs for superior thermal performance.

 Temperature Testing from

Temperature Testing Systems

Thermal Management | Accelerated Life Testing | Ambient Temperature Sensor Testing | Temperature Test Systems | Temperature Controlled Chambers | Thermal Stress Prediction

 

Test Engineers can use ThermalAir system equipment and our test chambers to bring their Printed Circuit Boards (PCBs) to temperature from -80°C to +300°C. Our systems generate a hot and cold thermal air stream directly on the parts that require thermal testing.

 

 

Our small thermal test chambers used in combination with the ThermalAir TA-5000 products have a temperature range from -100°C to +225°C without the use of LN2 or Co2.

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PCB Thermal Testing

 

Electronic failures occur due to thermally induced stresses and strains caused by excessive differences in coefficients of thermal expansion (CTE) across materials in PCB’s. As temperature of an electronic systems and component rises, the heat loss increases. Temperatures may be high enough to significantly decrease the life of components, causing devices to fail. Thermal cycling tests are critical to ensure product reliability in PCB’s, electronics, and materials.

 

TA-5000 Thermal Testing Systems helps engineers design reliable PCB’s and electronic components to withstand today’s increasing environmental stress conditions.

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Thermal Cycling – Thermal Characterization – Thermal Cycling – Temperature Cycling  – IC Package Test – Thermal Profiling | Thermal Cycling

Bring temperature directly to your test location for electronic and non-electronic components from temperature -100C to +225C.

 

 

The excessive difference in coefficients of thermal expansion between the components and the printed board cause strain in solder and embedded copper structures to induce a fatigue or failure. Temperature changes, not just component shapes or quality, in electronics assemblies are a critical part of the fatigue prediction. Thermal Cycling Testing is used to to evaluate and predict Fatigue Life of PCBs. This thermal cycle test is repeated ranging from a high temperature testing ranges to a low temperature testing ranges to accurately predict the fatigue life cycle of a Printed Circuit Board through heat stress analysis. 

Temperature Range Testing IC – Accelerated Life Testing – Thermal Cycling – Thermal Cycling  – Semiconductor Reliability Testing – Thermal Profiling | PCB Thermal Test

Thermal Cycling – Accelerated Life Testing – Thermal Cycling –  IC Package Test – Thermal Profiling – Thermal Cycling

MPI Thermal thermal inducing equipment is portable and can easily be moved from one test station to another. Automotive Component manufacturers can use our ThermalAir TA-5000 system to quickly bring their parts to temperature right at the test location. Temperature cycling, thermal profiling and other environmental temperature conditioning is why MPI Thermal systems are part of the manufacturing temperature test process.

 

This is why the MPI Thermal TA-5000 Series of ThermalAir temperature products are part of the test.

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Highly Accelerated Thermal Shock

 

Thermal shock testing has long been the accepted method to check the reliability of plated-through holes and solder joint connections and to determine the reliability of electrical interconnects in PCB’s. Reliability testing has become increasingly important to the electronics and PCB industries.

This is why the MPI ThermalAir temperature cycling systems are part of the test.

Semiconductor Reliability Testing – Thermal Characterization – Semiconductor TestingSemiconductor Testing  – Thermal Cycling – Temperature Testing BGA

Temperature Forcing System

 

The majority of electronic failures occur due to thermally induced stresses caused by excessive differences in coefficients of thermal expansion (CTE) across materials.

MPI ThermalAir Temperature Forcing Systems and environmental test chambers provide quality assurance through temerpature cycling testing. TA-5000 is a mobile thermal testing solution capable of environmental stress testing throughout the semiconductor design, manufacturing, and back end test processes.

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Thermal Cycle Testing of PWBs

 

Reliability testing of printed wire boards (PWBs) by thermal cycling offers the ability to compare relative survivability through assembly and reliability in the end use environment. Thermal cycle testing of PWBs is generally focused on the failure of the conductive circuits and interconnections. Testing is achieved by thermal cycling a representative coupon with the same constructions and design attributes as the associated PWB.

The ThermalAir TA-5000 products have a wide range of temperature test capabilities. Bench top -40°C to +80°C applications to temperature cycling -100°C to +300°C environmental test. The TA-5000 is used for temperature testing in engineering product development test labs and production test floors for semiconductor IC’c,  non-electronic components, PWB’s, and other parts and assemblies.

Electronic Assemblies (PCB’s) are manufactured from a wide range of materials with various coefficients of thermal expansion. As these assemblies experience temperature changes, the CTE (Coefficient of Thermal Expansion) mismatches place shear strains on different components in the PCB assemblies resulting in cracks in solder joints that can propagate resulting in failure. Thermal Cycling is used in accelerated life testing of joints to determine product reliability.     

ThermalAir Series of temperature testing systems and environmental test chambers play a critical role in determining product reliability by providing flexible thermal stress testing systems that produces precise a temperature controlled, hot and cold air stream directly to the parts and electronics requiring thermal cycling and environmental stress testing.

TA5000 Series are 50% more energy efficient.

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Tempertaure Cycling System
Thermal Cycling Test
Small Temperature Test Chamber
Thermal Cycling Test Enclosure
Thermal Test Enclosure

Thermal Cycling – Semiconductor Testing – Testing Operating Temperature of IC – Thermal Testing PCB  – Failure Analysis Testing – Semiconductor Reliability Testing | Highly Accelerated Thermal Shock

Thermal Cycling Test Systems

 

 

The MPI Thermal Cycling Test Systems provide Precise Thermal Forcing and Temperature Testing Capabilities for Electronic and Non-Electronic Components.

 

 

The ThermalAir TA-5000 Series brings precise thermal testing capabilities directly to your test application, exactly localizing to where thermal cycling is required. In the lab or on the production floor, the ThermalAir TA-5000 Series configurations provide flexible test solutions for an array products and technologies.

 

ThermalAir Thermal Test
Systems for Electronics

The design challenges go well beyond simply delivering processing power and high-speed data transfer. Design engineers must also safely manage heat generated by those processes in the confines of tight vehicle packaging requirements, as well as ambient and cold temperature fluctuations, while adhering to stringent safety and reliability standards of the electronics industry.

TA1000 Temperature Cycling Test System | Thermal Cycling Test | Temperature Cycling Test Equipment |Thermal Cycling

Environmental Stress Testing

Environmental stress conditions such as radiation exposure, temperature extremes, vibration, and dirt encountered by the military, on factory floors, and under the hoods of automobiles, these semiconductor devices need to keep working. To assure quality and reliability of electronic devices, semiconductor manufacturers need to simulate harsh environments during the engineering and production test stage. This is why the MPI Thermal TA-5000 Series ThermalAir temperature test products are part of the test.

 Temperature Cycle Test – Temperature Forcing Electronics –  Temperature Test Electronics – Temperature Forcing Systems –  Ambient Temperature Test Electronics

ThermalAir Thermal Test
Systems for Electronics

The design challenges go well beyond simply delivering processing power and high-speed data transfer. Design engineers must also safely manage heat generated by those processes in the confines of tight vehicle packaging requirements, as well as ambient and cold temperature fluctuations, while adhering to stringent safety and reliability standards of the electronics industry.

Environmental Stress Testing

Environmental stress conditions such as radiation exposure, temperature extremes, vibration, and dirt encountered by the military, on factory floors, and under the hoods of automobiles, these semiconductor devices need to keep working. To assure quality and reliability of electronic devices, semiconductor manufacturers need to simulate harsh environments during the engineering and production test stage. This is why the MPI Thermal TA-5000 Series ThermalAir temperature test products are part of the test.

TA1000 Temperature Cycling Test System | Thermal Cycling Test | Temperature Cycling Test Equipment |Thermal Cycling

PCB Thermal Test –  Environmental Stress Testing –  Temperature Test Electronics –  Thermal Test Systems  – Temperature Inducing Electronics

Thermal Cycle PCB’s, Componets, and Parts

The ThermalAir TA-5000 Series can provide accurate temperature stimuli so the electronic component manufacturers can design, develop and produce highly reliable quality parts that meet the demanding standards of today’s electronic technologies.

All types of electronic and non-electronic devices require temperature cycling and thermal shock test to make sure industrial products are unaffected by changes in temperature and other harsh environmental stress conditions.

Temperature Cycling Test System | Thermal Cycling Test | Temperature Cycling Test Equipment |Thermal Cycling

Temperature Forcing System

MPI ThermalAir temperature forcing systems provide a direct thermal stream of clean dry hot and cold air directly to the part that needs to be thermal tested. In the lab or on the production floor, ThermalAir Series provide unparalleled thermal stress testing  capabilities for scientist and engineers.

The ThermalAir system allows you to generate very precise controlled temperature for simulation test in Thermal Shock, Temperature Conditioning, Stress Screening, Temperature Cycling and more. Thermal test processes can be accomplished with our ThermalAir system. Ramp, Cycle, Dwell and Soak times are fully programmable with a touch of a button.

Onscreen User Manual
Datalog Screen

Easy Icon at a touch
Cycle Screen
Main Operator Screen
Dual Touch Screens
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 Environmental Test Electronics –  PCB Thermal Shock – Temperature Test Microelectronics –  Thermal Test Systems  –  Temperature Testing Circuit Boards

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