Thermal Cycling – On-Chip Thermal Testing – Thermal Characterizing ASICs – Thermal Cycling ASICs – Semiconductor Reliability Testing – Temperature Test ASICs
On-Chip Thermal Testing – Thermal Cycling BGA – Temperature Characterization ASICs – Thermal Cycling – Factory Testing – Temperature Testing BGA
Thermal Cycling ASICs – BGA Reliability Testing – IC Package Test – Semiconductor Reliability Testing – Thermal Profiling – Accelerated Life Testing
Thermal Cycling ASICs – Accelerated Life Testing – Temperature Characterization ASICs – Accelerated Life Testing – Factory Testing – Accelerated Life Testing
Semiconductor Industry & Applications
MPI Thermal’s TA-5000 series offers the best thermal testing solutions for semiconductor manufacturing’s final test process. These systems, which include temperature forcing and environmental test chambers, are crucial for achieving optimal thermal testing results. By revolutionizing DUT thermal cycling tests, the TA-5000 series enhances performance, reliability, and profitability for manufacturers. Choose MPI Thermal’s TA-5000 series for the most advanced and effective thermal testing solutions.
Temperature Testing from
Temperature forcing systems and environmental test chambers are critical to the final test process in semiconductor manufacturing. To achieve the best thermal testing solutions, MPI Thermal’s TA-5000 series is the way to go. This state-of-the-art technology is revolutionizing DUT thermal cycling tests, improving performance, reliability, and profitability for manufacturers. For optimal results, choose MPI Thermal’s TA-5000 series.
Product engineers and test engineers in the lab and on the semiconductor production floor use and share the ThermalAir temperature forcing systems to bring their devices to temperature ranges from -55°C to +125°C. ThermalAir environmental temperature test systems generate a hot and cold air stream directly on the device under test (DUT).
The ThermalAir TA-5000 has a temperature range from -80°C to +225°C without the use of LN2 or CO2. Our portable self-contained thermal inducing systems only need to be plugged in. This lets you easily temperature test your electronic semiconductor IC devices.
Download the DataSheets
Thermal Cycling BGAs
MPI ThermalAir Thermal Test Systems Brings Precise Temperature Testing capabilities directly to the parts, components, PCBs, MEMs, MCMs, BGAs, CSP assemblies, and electronics. Our flexible, mobile thermal air forcing systems and benchtop test chambers provide a stream of hot or cold air directly to the test. ThermaAir provides engineers and researchers an accurate temperature controlled test environment capable of performing rapid temperature cycling in their lab or on the production floor.
Outputs a controlled clean dry thermal air stream directly on your test part
Thermal Cycling Tests are used to to evaluate and predict Fatigue Life of Semiconductor Devices. These thermal cycle tests are repeated, cycling from high temperature testing ranges to a low temperature testing ranges to accurately predict the fatigue life cycle of a device through heat stress and failure analysis.
ThermalAir thermal cycling test systems perform at the the mil-spec thermal testing range of -55°C to +125°C (actual test range -100°C to +300°C), with fast thermal cycling test capabilities in just seconds. Control temperature transition times, set ramp, soak, and cycle with a touch.
This is why the MPI Thermal TA-5000 Series ThermalAir Thermal Cycle Test Systems are used for accurate temperature testing and are an integral part of the semiconductor testing, manufacturing, and IC packaging process.
Download the Datasheets
Thermal Characterization of IC Packages
In semiconductor manufacturing, the final test process is critical to ensuring optimal performance and reliability of integrated circuits and IC devices. Temperature forcing systems and environmental test chambers play a crucial role in this process, and MPI Thermal’s TA-5000 series offers the best thermal testing solutions. This state-of-the-art technology is revolutionizing DUT thermal cycling tests, improving performance, reliability, and profitability for manufacturers. Don’t compromise on the quality of your thermal testing – choose MPI Thermal’s TA-5000 series.
TA-5000 Series temperature cycling are a series of high capacity thermal air stream systems that are used for temperature testing of BGAs, accelerated thermal cycling and device temperature characterization of components, hybrids, modules, PCBs, CSPs, BGAs, and other electronic and non-electronic assemblies at precise temperatures from -100°C to +225°C
TA-5000 Series temperature cycling are a series of high capacity thermal air stream systems that are used for temperature testing of BGAs, accelerated thermal cycling and device temperature characterization of components, hybrids, modules, PCBs, CSPs, BGAs, and other electronic and non-electronic assemblies at precise temperatures from -100°C to +225°C
Some Applications
- Thermal Cycling Test
- Reliability Testing
- Fatigue Life Prediction
- Heat Stress Analysis
- Failure Analysis Testing
- PCB Thermal Analysis
- Accelerated Life testing
- Thermal Characterization
- Temperature Profiling
And More…
Thermal Cycling BGA – BGA Reliability Testing – Thermal Characterizing ASICs – Thermal Cycling ASICs – Semiconductor Reliability Testing – Accelerated Life Testing
Accelerated Thermal Cycling & Reliability Testing of BGAs and CSPs
Our Precision Thermal Stress Test Systems use a direct temperature-controlled stream of hot or cold air to provide a precise test environment for thermal stress testing BGAs & CSPs, thermal profiling and thermal cycling tests of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature system enables an accurate thermal cycling test for BGA package testing, allowing you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench, or directly on the unit under test. Our portable self-contained thermal inducing systems only need to be plugged in and you’re ready for test, easily allowing fatigue life test of electronic semiconductor IC devices.
Download the Datasheets
Thermal Cycling Testing of BGAs and CSPs
Product and Test Engineers in the lab and on the semiconductor production floor use and share the ThermalAir thermal inducing stress cycling systems to bring their devices to temperature ranges from -55°C to +125°C in just seconds. ThermalAir environmental temperature test systems provide accelerated thermal cycling through a hot and cold air stream directly on the device under test (DUT). The ThermalAir TA-5000 has a thermal cycling test range from -100°C to +225°C without the use of Ln2 or CO2.
- Ultra Cold Temperatures maintained at 50&60Hz
- Dual Touch Screens Front Panel & Thermal Head
- Plug-in anywhere from 200~250VAC, 1Ø
- ECO Smart DC system for up to 50% energy saving
- No voltage configuration to use at different locations
Accelerated Life Testing – Accelerated Life Testing ASICs – Semiconductor Reliability Testing – IC Package Test – Accelerated Life Testing CSP – Factory Testing BGA
ThermalAir Series of temperature testing systems and thermal cycling test chambers play a critical role in determining product reliability testing by providing flexible thermal stress testing systems that provide a temperature controlled hot and cold air stream directly to the parts and electronics requiring environmental stress testing.
- Temperature Range -100°C to +225°C
- No LN2 or Co2
- Fastest ramp rates
- Up to 20 SCFM Air Flow
- Set Ramp, Soak & Cycle
- Real Time Graphic Display
- Data Logging
Download the Datasheets
Thermal Cycling BGAs
MPI ThermalAir Temperature Test Systems Brings Precise Temperature testing capabilities directly to the parts, components, PCBs, MEMs, MCMs, BGAs, CSP assemblies, and electronics. Our flexible, mobile thermal air forcing systems and benchtop test chambers provide a stream of hot or cold air directly to the test. ThermaAir provides engineers and researchers an accurate temperature controlled test environment capable of performing rapid temperature cycling in ther lab or on the production floor.
Thermal Characterization of IC Packages
Thermal Cycling of packaged semiconductor devices is critical for the performance and reliability of IC applications. Thermal management, thermal resistance, and temperature characterization must be taken into account to ensure product reliability. All Semiconductor ICs generate heat when power is applied to them. To maintain the device’s junction temperature below the maximum allowed, adequate heat flow from the semiconductor IC through the package to the ambient is critical.
TA-5000 Series temperature cycling are a series of high capacity thermal air stream systems that are used for temperature testing of BGAs, accelerated thermal cycling and device temperature characterization of components, hybrids, modules, PCBs, CSPs, BGAs, and other electronic and non-electronic assemblies at precise temperatures from -100°C to +225°C
Accelerated Life Testing – Thermal Cycling BGA – Thermal Cycling – Semiconductor Reliability Testing – Accelerated Life Testing CSP – Semiconductor Reliability Testing
Accelerated Thermal Cycling & Reliability Testing of BGAs and CSPs
Our Precision Thermal Stress Test Systems use a direct temperature-controlled stream of hot or cold air to provide a precise test environment for thermal stress testing BGAs & CSPs, thermal profiling and thermal cycling tests of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature system enables an accurate thermal cycling test for BGA package testing, allowing you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench, or directly on the unit under test. Our portable self-contained thermal inducing systems only need to be plugged in and you’re ready for test, easily allowing fatigue life test of electronic semiconductor IC devices.
Temperature Forcing System
Precision Temperature Forcing Systems use a direct temperature-controlled stream of hot or cold air to provide a precise thermal environment for temperature testing, thermal conditioning and temperature cycling of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature system enables the test. This allows you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench or directly on the unit under test.
Thermal Test Equipment – Thermal Shock – Temperature Range Test – Thermal Shock – Environmental Test Chamber
Temperature Cycling Test Systems
Product engineers and test engineers in the lab and on the semiconductor production floor use and share the ThermalAir temperature forcing systems to bring their devices to temperature ranges from -55°C to +125°C. ThermalAir environmental temperature test systems generate a hot and cold air stream directly on the device under test (DUT).
ThermalAir TA-5000B with Environmental Test Chamber
Precision Temperature Forcing Systems use a direct temperature-controlled stream of hot or cold air to provide a precise thermal environment for temperature testing, conditioning and cycling of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature system enables the test. This allows you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench or directly on the unit under test.
