Accelerated Life Testing – Thermal Testing BGA Packages – Accelerated Life Testing  – Semiconductor Testing  – Failure Analysis Testing – Semiconductor Testing

Thermal Cycling – Thermal Cycling BGA – Temperature Testing of BGA – Thermal Characterization  – Thermal Profiling – Thermal Cycling

Semiconductor Reliability Testing – Thermal Cycling – IC Package Test – Failure Analysis Testing  – IC Package Test – Testing Operating Temperature of ICs

Thermal Characterization – Thermal Cycling BGA – Testing Operating Temperature of IC – Semiconductor Reliability Testing – Semiconductor TestingSemiconductor Testing

Accelerated Life Testing – Accelerated Life Testing – Thermal Profiling – Accelerated Life Testing  – Thermal Cycling – Semiconductor Reliability Testing

Thermal Characterization – Accelerated Life Testing – Semiconductor Testing –  IC Package Test – Thermal Profiling – Thermal Cycling

Semiconductor Industry & Applications

Throughout the semiconductor manufacturing, engineers design integrated circuits and IC devices. This process of manufacturing semiconductors (commonly called ICs, or chips) can consist of more than a hundred steps. Our Temperature forcing systems and e environmental test chambers are an integral part of the final test process.

MPI Thermal TA-5000 series state-of-the-art thermal testing solutions are changing the way thermal cycling tests of DUT’s are performed allowing semiconductor manufacturers to improve performance, reliability, and profitability through greater efficacy of manufacturing Semiconductor ICs and wafer testing processes.


Thermal Cycling BGAs


MPI ThermalAir Test Systems Brings Precise Temperature testing capabilities directly to the parts, components, PCBs, MEMs, MCMs, BGAs, CSP assemblies, and electronics. Our flexible, mobile thermal air forcing systems and benchtop test chambers provide a stream of hot or cold air directly to the test. ThermaAir provides engineers and researchers an accurate temperature controlled test environment capable of performing rapid temperature cycling in ther lab or on the production floor.

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Thermal Characterization of IC Packages

Thermal Cycling of packaged semiconductor devices is critical for the performance and reliability of IC applications. Thermal management, thermal resistance, and temperature characterization must be taken into account to ensure product reliability. All Semiconductor ICs generate heat when power is applied to them. To maintain the device’s junction temperature below the maximum allowed, adequate heat flow from the semiconductor IC through the package to the ambient is critical.

TA-5000 Series temperature cycling are a series of high capacity thermal air stream systems that are used for temperature testing of BGAs, accelerated thermal cycling and device temperature characterization of components, hybrids, modules, PCBs, CSPs, BGAs, and other electronic and non-electronic assemblies at precise temperatures from -100°C to +225°C

Accelerated Life Testing – BGA Reliability Testing – IC Package Test –  IC Package Test – Thermal Profiling – Thermal Profiling

Thermal Cycling Tests are used to to evaluate and predict Fatigue Life of Semiconductor Devices. These thermal cycle tests are repeated, cycling from high temperature testing ranges to a low temperature testing ranges to accurately predict the fatigue life cycle of a device through heat stress and failure analysis. 

ThermalAir thermal cycling test systems perform at the the mil-spec thermal testing range of -55°C to +125°C (actual test range -100°C to +300°C), with fast thermal cycling test capabilities in just seconds. Control temperature transition times, set ramp, soak, and cycle with a touch.

This is why the MPI Thermal TA-5000 Series ThermalAir Thermal Cycle Test Systems are used for accurate temperature testing and are an integral part of the semiconductor testing, manufacturing, and IC packaging process.

Thermal Cycling Test

Products Overview


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Some Applications


  • Thermal Cycling Test
  • Reliability Testing
  • Fatigue Life Prediction
  • Heat Stress Analysis
  • Failure Analysis Testing
  • PCB Thermal Analysis
  • Accelerated Life testing
  • Thermal Characterization
  • Temperature Profiling

          And More…

Accellerated Thermal Cycling & Reliability Testing of BGAs and CSPs

 Our Precision Thermal Stress Test Systems use a direct temperature-controlled stream of hot or cold air to provide a precise test environment for thermal stress testing BGAs & CSPs, thermal profiling and thermal cycling tests of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature system enables an accurate thermal cycling test for BGA package testing, allowing you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench, or directly on the unit under test. Our portable self-contained thermal inducing systems only need to be plugged in and you’re ready for test, easily allowing fatigue life test of electronic semiconductor IC devices.


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Thermal Cycling Testing of BGAs and CSPs

Product and Test Engineers in the lab and on the semiconductor production floor use and share the ThermalAir thermal inducing stress cycling systems to bring their devices to temperature ranges from -55°C to +125°C in just seconds. ThermalAir environmental temperature test systems provide accelerated thermal cycling through a hot and cold air stream directly on the device under test (DUT). The ThermalAir TA-5000 has a thermal cycling test range from -100°C to +225°C without the use of Ln2 or CO2.

  • Ultra Cold Temperatures maintained at 50&60Hz
  • Dual Touch Screens Front Panel & Thermal Head
  • Plug-in anywhere from 200~250VAC, 1Ø
  • ECO Smart DC system for up to 50% energy saving
  • No voltage configuration to use at different locations

Thermal Cycling BGA – Thermal Testing BGA Packages – Accelerated Life Testing  – Semiconductor Testing  – Thermal Profiling – Semiconductor Reliability Testing

ThermalAir Series of temperature testing systems and thermal cycling test chambers play a critical role in determining product reliability testing by providing flexible thermal stress testing systems that provide a temperature controlled hot and cold air stream directly to the parts and electronics requiring environmental stress testing.


  • Temperature Range -100°C to +225°C
  • No LN2 or Co2
  • Fastest ramp rates
  • Up to 20 SCFM Air Flow
  • Set Ramp, Soak & Cycle
  • Real Time Graphic Display
  • Data Logging

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