Semiconductor Industry & Application
In semiconductor manufacturing, engineers design & test integrated circuits and IC devices. The process of manufacturing semiconductors (commonly called ICs, or chips) consists of more than a hundred steps. Temperature forcing systems and environmental test chambers are part of the final test process. These environmental test assure quality and help with failure analysis by environmental stressing the device throughout the semiconductor product design and manufacturing back end test.
Accelerated Life Testing – Thermal Testing BGA Packages - Testing ICs – Thermal Cycle BGAs – Accelerated Life Testing CSP – Semiconductor Testing | Temperature Cycling
Semiconductor IC Test Solutions
In semiconductor manufacturing, engineers design & perform thermal cycling test integrated circuits and IC devices. The process of manufacturing semiconductors ICs (commonly called ICs, or chips) consists of more than a hundred steps. Temperature forcing systems and environmental test chambers are part of the final test process. These environmental test assure quality and help with failure analysis by environmental stressing the device throughout the semiconductor product design and manufacturing back end test.
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Semiconductor Thermal Cycling
In the manufacturing of semiconductors electronic components for harsh environments, the IC package assembly and test stages of engineering and production include burn-in,electronic hot and cold testing at temperature,and other environmental test simulations. These semiconductor devices and electronics, once put in real world applications,can get exposed to extreme environmental conditions.
MPI ThermalAir Temperature Forcing Systems and environmental test chambers provide quality assurance through failure analysis testing by providing a mobile thermal testing solution capable of environmental stress testing throughout the semiconductor design, manufacturing, and back end test processes.
Thermal Cycling – Thermal Cycling BGA -IC Tester – Thermal Testing PCB – Thermal Profiling – Thermal Profiling | PCB Stress Testing
Temperature Testing ICs
Environmental stress conditions such as radiation exposure, temperature extremes, vibration, and dirt encountered by the military, on factory floors, and under the hoods of automobiles, these semiconductor devices need to keep working. To assure quality and reliability of electronic devices, semiconductor manufacturers need to simulate harsh environments during the engineering and production test stage. This is why the MPI Thermal TA-5000 Series ThermalAir temperature test products are part of the test.
Semiconductor Reliability Testing – BGA Reliability Testing – Semiconductor Testing – Accelerated Life Testing – Semiconductor Testing – Thermal Profiling
Some Applications
- Product Engineering
- Back-End Test
- IC Tester
- IC Handler Verification
- Semiconductor Package Test
- Cooling the IC while Stress Full Cycle
- Failure Analysis
- Final Test
And More…
Precision Temperature Forcing Systems use a direct temperature-controlled stream of hot or cold air to provide a precise thermal environment for temperature testing semiconductor ICs, conditioning and cycling of electronic and non-electronic assemblies, and sub-systems. The ThermalAir Temperature Test System is an IC Tester for Semiconductor Back-End test. This allows you to perform temperature simulation tests in situ, at a specific location, at your IC tester station, test bench or directly on the unit under test.
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Product Engineers and Test Engineers in the lab and on the semiconductor production floor use and share the ThermalAir temperature forcing systems to bring their devices to temperature ranges from -55°C to +125°C. ThermalAir environmental temperature test systems generate a hot and cold air stream directly on the device under test (DUT). The ThermalAir TA-5000 has a temperature range from -90°C to +225°C without the use of Ln2 or CO2. Our portable self-contained thermal inducing systems only need to be plugged in and you’re ready for test. This lets you easily temperature test your electronic semiconductor IC devices.
Temperature characterization of thermal packages is crucial for the reliability and performance of IC applications. To maintain the device’s junction temperature below the maximum allowed, adequate heat flow from the semiconductor IC through the package to ambient temperatures is critical. Thermal analysis and testing helps provide accurate package and system thermal predictions.
ThermalAir Series of temperature testing systems and environmental test chambers play a critical role in determining product reliability by providing flexible thermal stress testing systems that provide a temperature controlled hot and cold air stream directly to the parts and electronics requiring environmental stress testing.
TA5000 Series are 50% more energy efficient.
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Temperature Range Testing IC – Thermal Testing BGA Packages - Temperature Forcing Systems – Thermal Cycling – Failure Analysis Testing – Thermal Cycling | PCB Stress Testing