Environmental Temperature Testing Critical
Electronics Electro-Mechanical Parts and
Materials in Vehicles
Automotive components manufacturers have the need to improve product quality and reliability. All types of transportation vehicles have higher system environmental temperature testing requirements. Car manufacturers today are faced with increasing challenges with environmental thermal testing.
Automotive Electronics Testing | Temperature Cycling | Thermal Test Systems | Temperature Inducing Systems | Thermal Stress Test | Automotive Electronics Test
Automotive Electronics Testing
Test Engineers can use ThermalAir system equipment and our test chambers to bring their automotive components to temperature from -40°C to +125°C. Our systems generate a hot and cold thermal air stream directly on the parts that require thermal testing.
Our bench top chambers used in combination with the ThermalAir TA-5000 product have a temperature range from -90°C to +225°C without the use of LN2 or Co2.
Thermal Test Systems
Without the appropriate tools for adequate thermal measurement and testing, automotive research and design engineers can lose time and efficiency, and can lead to dangerous product defects and expensive recalls.
Our thermal test systems are self-contained. They just need to be plugged in and you‘re ready to bring temperature to your test. This lets you easily temperature test your automotive critical electronics, electro-mechanical parts, electronic and non-electronic components.
Our new thermal test technology gives the end user the ability to easily test while controlling the ramp rate speed with one touch temperature set point functions.
The ThermalAir TA-5000 system provides temperature directly to automotive electronic and mechanical parts
Fast Ramp & Cycle Temperature Testing
ThermalAir Systems for Automotive Part Manufacturers
OEM Automotive Components
Electronics continue to infiltrate all aspects of automotive design as consumer demand for safety, performance, and reliability continues to grow. Automotive Electronic design incorporates semiconductor components, electronic sensors, and sub-systems. Automobiles have over 50 sensors, switches and other electronic controls. These components require temperature conditioning and fast temperature cycling at ranges -40C to +125C and beyond.
MPI ThermaiAir thermal test systems allow design engineers to thermal stress test automotive parts, plastics, electronics, and sensors in the early stages of automotive design and development, saving time while reducing the risk of defects that may occur in later stages of design and assembly.
MPI Thermal temperature inducing equipment is portable and can easily be moved from one test station to another. Automotive Component manufacturers can use our ThermalAir TA-5000 system to quickly bring their parts to temperature right at the test location. Temperature cycling, thermal profiling and other environmental temperature conditioning is why MPI Thermal systems are part of the manufacturing temperature test process.
Automotive Tier 1 and Tier 2 component manufacturers need to simulate temperature environments during the engineering and production test process to assure they work once installed in a vehicle.
This is why the MPI Thermal TA-5000 Series of ThermalAir temperature products are part of the test.
Download the Datasheets
Fast Ramp & Cycle Temperature Testing ThermalAir Systems for Automotive Part Manufacturers
ThermalAir Systems for Automotive Applications
-
One system fits all temperature ranges -90°C to +225°C
-
Plug in anywhere 200 to 25OVAC, 20amp, 50/60Hz
-
Up to 20 SCFM continuous airflow capacity Hot & Cold
-
Fastest temperature ramp rates without the use of LN2 or CO2
-
Systems are easily moved for sharing between workstations or testers.
Bring temperature to your test for automotive electronics and non-electronic components from temperature -40C to +150C.
- Automotive Sensors
- Vehicle Control Products
- Electronic control units or ECUs
- Incoming Inspection
- Semiconductor IC Verification
- Simulation-based testing
- Cooling Heating Stress Full Cycle
- Design or fabrication weaknesses
- Fast Hot & Cold Thermal Cycling
- Electronic and Mechanical subsystems