PCB Reliability Test
Printed Circuit Boards (PCBs) need to go through a series of extensive tests and inspections at each step of the manufacturing process to assure the products meets or exceed specifications.
Reliability decreases exponentially in electronic components due to heat problems. ThermalAir series of thermal testing cycling test systems helps manufacturers design ICs, chips, and PCBs for superior thermal performance.
Test Engineers can use ThermalAir system equipment and our test chambers to bring their Printed Circuit Boards (PCBs) to temperature from -80°C to +300°C. Our systems generate a hot and cold thermal air stream directly on the parts that require thermal testing.
Our small thermal test chambers used in combination with the ThermalAir TA-5000 products have a temperature range from -100°C to +225°C without the use of LN2 or Co2.
PCB Thermal Testing
Electronic failures occur due to thermally induced stresses and strains caused by excessive differences in coefficients of thermal expansion (CTE) across materials in PCB’s. As temperature of an electronic systems and component rises, the heat loss increases. Temperatures may be high enough to significantly decrease the life of components, causing devices to fail. Thermal cycling tests are critical to ensure product reliability in PCB’s, electronics, and materials.
TA-5000 Thermal Testing Systems helps engineers design reliable PCB’s and electronic components to withstand today’s increasing environmental stress conditions.
Bring temperature directly to your test location for electronic and non-electronic components from temperature -100C to +225C.
The excessive difference in coefficients of thermal expansion between the components and the printed board cause strain in solder and embedded copper structures to induce a fatigue or failure. Temperature changes, not just component shapes or quality, in electronics assemblies are a critical part of the fatigue prediction. Thermal Cycling Testing is used to to evaluate and predict Fatigue Life of PCBs. This thermal cycle test is repeated ranging from a high temperature testing ranges to a low temperature testing ranges to accurately predict the fatigue life cycle of a Printed Circuit Board through heat stress analysis.
MPI Thermal thermal inducing equipment is portable and can easily be moved from one test station to another. Automotive Component manufacturers can use our ThermalAir TA-5000 system to quickly bring their parts to temperature right at the test location. Temperature cycling, thermal profiling and other environmental temperature conditioning is why MPI Thermal systems are part of the manufacturing temperature test process.
This is why the MPI Thermal TA-5000 Series of ThermalAir temperature products are part of the test.
Download the Datasheets
Highly Accelerated Thermal Shock
Thermal shock testing has long been the accepted method to check the reliability of plated-through holes and solder joint connections and to determine the reliability of electrical interconnects in PCB’s. Reliability testing has become increasingly important to the electronics and PCB industries.
This is why the MPI ThermalAir temperature cycling systems are part of the test.
Temperature Forcing System
The majority of electronic failures occur due to thermally induced stresses caused by excessive differences in coefficients of thermal expansion (CTE) across materials.
MPI ThermalAir Temperature Forcing Systems and environmental test chambers provide quality assurance through temerpature cycling testing. TA-5000 is a mobile thermal testing solution capable of environmental stress testing throughout the semiconductor design, manufacturing, and back end test processes.
Download the Datasheets
Thermal Cycle Testing of PWBs
Reliability testing of printed wire boards (PWBs) by thermal cycling offers the ability to compare relative survivability through assembly and reliability in the end use environment. Thermal cycle testing of PWBs is generally focused on the failure of the conductive circuits and interconnections. Testing is achieved by thermal cycling a representative coupon with the same constructions and design attributes as the associated PWB.
The ThermalAir TA-5000 products have a wide range of temperature test capabilities. Bench top -40°C to +80°C applications to temperature cycling -100°C to +300°C environmental test. The TA-5000 is used for temperature testing in engineering product development test labs and production test floors for semiconductor IC’c, non-electronic components, PWB’s, and other parts and assemblies.
Electronic Assemblies (PCB’s) are manufactured from a wide range of materials with various coefficients of thermal expansion. As these assemblies experience temperature changes, the CTE (Coefficient of Thermal Expansion) mismatches place shear strains on different components in the PCB assemblies resulting in cracks in solder joints that can propagate resulting in failure. Thermal Cycling is used in accelerated life testing of joints to determine product reliability.
ThermalAir Series of temperature testing systems and environmental test chambers play a critical role in determining product reliability by providing flexible thermal stress testing systems that produces precise a temperature controlled, hot and cold air stream directly to the parts and electronics requiring thermal cycling and environmental stress testing.
TA5000 Series are 50% more energy efficient.
Download the Datasheets
Thermal Cycling Test Systems
The MPI Thermal Cycling Test Systems provide Precise Thermal Forcing and Temperature Testing Capabilities for Electronic and Non-Electronic Components.
The ThermalAir TA-5000 Series brings precise thermal testing capabilities directly to your test application, exactly localizing to where thermal cycling is required. In the lab or on the production floor, the ThermalAir TA-5000 Series configurations provide flexible test solutions for an array products and technologies.
PCB Thermal Test | Thermal Management | Temperature Cycling | Thermal Testing PCB | Thermal Cycling | PCB Stress Testing | Highly Accelerated Thermal Shock
Thermal Management Solutions for the Future
Thermal Testing Systems