Telecommunications systems, and equipment must be designed to meet a variety of stringent specifications, most importantly the Telcordia test requirements. Common systems and components requiring testing include fiber optics, line protector units, switch boxes, sensors, modules, connectors, outdoor networks interface devices, network switching systems, switching racks, cell phones, and more.
Environmental temperature controlled chambers can just go so far when it comes to precise thermal control, fast ramp rates, and narrow temperature margins in some product thermal test procedures and processes. Instead of taking your parts to a large temperature controlled chamber, ThermalAir Systems bring the temperature to your components at your test location.
HALT/HASS | Temperature Conditioning | Accelerated Stress Testing | Reliability Testing | Thermal Profiling | Accelerated Life Testing
ThermalAir Temperature Conditioning Systems
Thermal Cycling and Temperature Conditioning
The ThermalAir systems allow testing with temperature accuracy of +/- 1.0°C throughout the full temperature range -100°C to +225°C and temperature cycling while having full control of the temperature ramp rate. Our systems can ramp in seconds not minutes. This new thermal test technology gives you the ability to control the ramp rate with temperature set point functions.The ThermalAir systems provide localized temperature directly at your test site. This enables you to bring the temperature to the test station in engineering and manufacturing test.
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Telecommunication components and hardware need to meet Telcordia (Bellcore) specifications that require environmental humidity, vibration, and temperature testing. Thermal cycling, temperature conditioning, and environmental stressing of devices is considered vital to reliability and durability by simulating test conditions to meet user’s operating requirements in the field of use.
MPI Thermal TA-5000 series state-of-the-art thermal testing solutions are changing the way thermal cycling tests of DUT’s are performed allowing telecommunications equipment and component manufacturers to improve performance, reliability, and profitability through greater efficacy of manufacturing thermal testing processes.
MPI Thermal – Temperature Inducing Systems
Whether it’s thermal profiling, temperature cycling, thermal shock, or temperature conditioning, ThermalAir Temperature Test Systems can help with your temperature requirements.
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In the Telecommunications Industry, electronic components and equipment must be tested to confirm that everything functions properly as a system. In the telecommunications manufacturing process, individual components, modules, and other components need be temperature tested to assure reliability. Each piece needs to be designed to work when exposed to harsh temperature environments.
With Global warming on the rise, telecommunications equipment, components, and materials need the ability to withstand sudden changes in temperature. ThermaAir temperature test systems help provide and ensure long-term reliability testing of optical fiber components under harsh environmental stress conditions by testing components against the effects of thermal shock.
HALT & HASS Testing
In the Telecommunications Industry, a trend towards miniaturization and increased power density can be observed in both datacom equipment and throughout the electronics industry. These evolution’s bring with them many thermal management challenges.
HALT / HASS testing is the fastest and economical way to improve product reliability. HALT (Highly Accelerated Life Test) is used to discover design flaws by exposing parts & components to thermal stress testing and thermal cycle testing. Highly Accelerated Stress Screening (HASS) use temperature stress tests to eliminate design flaws, develop a reliable products, and filter out early product failure issues. HALT/HASS testing helps determines a product operating and failure limits by applying temperature stress to products through simulated thermal testing and continuous failure analysis.
Temperature Conditioning Solutions for the Future
Temperature Inducing Systems